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Parmi 3D SPI HS 60 L

Inspection Technology
Parmi 3D SPI HS 60 LParmi 3D SPI HS 60 LParmi 3D SPI HS 60 LParmi 3D SPI HS 60 L

Description

Manufacturer
Parmi
Type
HS 60 L
Year
2012
Status
Very good
  • 3D SPI system inline 
  • 3 D camera
  • min. paste size 150x150µm
  • max. paste size 20x20mm
  • max. paste hight 1000µm
  • min. PCB size 50x50mm
  • max. PCB size 500x510m
  • PCB thickness 0,4mm - 4mm
  • measurements 1060mm (width) x 1285mm (length) x 1400mm (hight)
  • weight 1000 kg    

  


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TWD GmbH
Thorsten Düvel
Leimberg 22
52222 Stolberg
Telephone: +49 2402 997540
Email: info@twdgmbh.de
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