TRI TR7007DI SPI
Description
A Test Research, Inc. TR7007DI 3D Solder Paste Inspection system is available for sale, designed for precise solder paste inspection in SMT production lines.
Key technical data:
Dual Digital Projector (shadow-free technology)
Camera: 12 MP
Height resolution: 0.5 µm
Height accuracy: 1.5 µm
Max. PCB size: 510 x 460 mm
PCB thickness: 0.6 – 5 mm
Weight: approx. 675 kg
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200–240 V, single-phase, 3 kVA
Inspection by appointment possible.
Dismantling and worldwide shipping can be arranged.
The sale is carried out in cooperation with AS-Equipment.
Thorsten Düvel
Leimberg 22
52222 Stolberg
Email: info@twdgmbh.de


